En el contexto se describe :A high-brightness single-die LED» y «A LED incorporating 100 dies", sugiere este último, de tratarse de un Led integrado en múltiples chips. Por tanto, solicitar single-die and dies no tine sentido.

die=chip en español (circuito integrado)
http://www.wordreference.com/es/translation.asp?tranword=chi...

A DIE is the actual silicon chip (IC) that would normally be inside a package/chip. Their just a piece of the wafer disk, but instead of being mounted and connected in a 'chip', and covered with epoxy.
https://electronics.stackexchange.com/questions/56649/what-i...



Multiple single die power LEDs potentially offer a better solution, particularly in applications such as street lighting.
The two biggest problems that face anyone designing high power LED luminaries is how to get rid of the heat and how to direct the light to where you want it.
https://www.electronicsweekly.com/news/products/led/multi-di...

Plessey has developed a revolutionary process using a buffer layer between the GaN and the silicon, enabling a gradual transition from one material to the other.

The Next Generation of LED, is without doubt; Multiple or integrated Chip, Referred to asMCOB (Multiple Chip On Board) or MCCOB (multiple chips and cups on board)

This new LED lighting technology comprises of many small “Gallium Nitrate” based crystals integrated into one large single chip.

COB (Chip on board) LED technology, differs from traditional LED in that instead of individual SMDs soldered to a circuit board and then mounted to a heat sink; the Wafers or “Wafern” are cut into some hundred small chips, with a thickness of only approx. 250 µm. These tiny small and hardly visible pieces of semiconductor crystal are bonded directly to the aluminum substrate (with a proprietary bonding procedure) allowing for optimum heat dissipation, and solderless fabrication.
https://www.linkedin.com/pulse/20140702035921-96617220-the-e...

The buffer layer has other advantages too: it enables the manufacture of larger LEDs with multiple junctions. This allows the process to be used in large die sizes that range from 3V to 24V, and to compete with multi-chip modules on performance and price

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Note added at 1 day23 hrs (2017-09-03 19:13:33 GMT)
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La repuesta tiene un typo : Led en un chip, multiples Led integrado en múltiples chips. En realidad, la palabra primera "múltiple" está demás.
La solución es: Led en un chip, y Led integrado en múltiples chips.

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Note added at 2 days8 mins (2017-09-03 19:45:18 GMT)
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Multi-die packages versus multiple single die power LEDs
https://www.electronicsweekly.com/news/products/led/multi-di...

Evenmore particularly , the present invention relates to a high power AllnGaN LED assembly comprising highly efficient, elongated chips assembled in a an optimized reflective package.
http://www.bridgelux.com/sites/default/files/US 9006765 - Mu...